Electric multilayer component

ABSTRACT

An electrical component having multiple layers includes dielectric layers that are stacked to form a main body, electrodes positioned at intervals between at least some of the dielectric layers, and at least two bumps configured to act as electrical contacts for the electrical component. The bumps are on a surface of the main body. The electrical component also includes contacts in the main body that electrically connect bumps and electrodes. The electrodes define first and second electrode stacks, each of which contacts one of the bumps.

TECHNICAL FIELD

The present invention relates to an electrical multilayer componentwhose main body is constructed from stacked dielectric material layers,between which electrode areas are positioned.

BACKGROUND

Multilayer components of this type may be used as capacitors, varistors,or temperature-dependent resistors (thermistors) depending on thecomposition of the dielectric material layers and the electrode layers.The main body of varistors is frequently manufactured from a mixture ofdifferent metal oxides, based on zinc oxide, for example. Varistors havenon-linear voltage-dependent resistance change, which is used to protectan electrical circuit from overvoltage. The resistance value ofvaristors falls with increasing applied voltage in this case. Multilayercomponents which are implemented as capacitors may absorb noises at highand low voltages.

A multilayer varistor, in which non-overlapping internal electrodes arepositioned in the interior of the main body to reduce the resistance, isknown from the publication DE 199 31 056 A1. The internal electrodes arecontacted in this case at the two front faces of the component bylarge-area contact layers which allow SMD mounting of the component. Thedisadvantage of this typical component is that because of the large-areacontact layers, parasitic capacitances and inductances are built up,which make precise setting of the electric characteristics of thecomponent difficult. Furthermore, because of the large contact layers, acomponent of this type correspondingly requires a large amount of spacewhen mounted on circuit boards, for example. Furthermore, above all,modules in this construction, in which multiple components of this typeare integrated, are especially large and therefore have an especiallylow integration density.

SUMMARY

The object of the present invention is to specify an electricalmultilayer component having high integration density, which hassignificantly reduced parasitic capacitances and inductances and alsoallows especially simple and space-saving mounting on a circuit board,for example.

This object is achieved according to the present invention by anelectrical multilayer component according to claim 1. Advantageousembodiments of the multilayer component are the object of dependentclaims.

The present invention describes an electrical multilayer component whosefunction is selected from that of a capacitor, a temperature-dependentresistor, and a varistor. The multilayer component has a main bodyconstructed from stacked dielectric material layers, multiple electrodeareas being arranged in the main body at intervals between thedielectric layers, in which electrode areas electrodes are formed.Furthermore, at least two solder balls (bumps) are arranged on thesurface of the main body for the electrical contact of the component, abump being connected in each case in an electrically conductive way toat least one electrode via through contacts arranged in the main body,so that a first and a second electrode stack are formed. As defined inthe present invention, electrode stacks may comprise not only multipleelectrodes, but rather, in the limiting case, even only one electrode.The electrically conductive through contacts, which connect theelectrodes to the bumps, are also referred to as vias. Because of thespecial contact of the electrodes, it is possible especially simply tointegrate multiple passive components, varistors, thermistors, orcapacitors in an electrical multilayer component according to thepresent invention.

A further advantage of the electrical component according to the presentinvention in relation to typical components which are implemented in SMDconstruction, for example, is that because of the bumps, which are usedfor the electrical contact of the electrodes arranged in the main body,significantly simpler contacting of the component is possible than intypical components. The bumps typically need much less space on thesurface of the main body than large-area contact layers, which are usedin case of typical SMD contacts. Because of the smaller size of thebumps, the parasitic capacitances and inductances are additionallysignificantly reduced in the component according to the presentinvention. Because of the smaller size of the bumps and the throughcontacts, it is also possible to integrate multiple individualcomponents with a high integration density into the electricalmultilayer component, so that multilayer component modules havingmultiple passive components may be constructed especially simply.

An electrode stack of a multilayer component according to the presentinvention may comprise multiple electrodes arranged in differentelectrode areas, these electrodes being connected to one another in anelectrically conductive way using through contacts arranged in the mainbody (see, for example, FIG. 2B).

In an advantageous embodiment of the multilayer component according tothe present invention, the at least two electrode stacks in the mainbody face one another, a region of the main body which has no electrodelayers being provided between the two electrode stacks. This means thatthe electrodes of the first and second electrode stacks do not overlapone another. An embodiment of this type of the electrodes in the mainbody is especially advantageously suitable for the purpose of varyingthe resistance of the component depending on the precise embodiment ofthe electrodes.

In a further advantageous embodiment, the electrodes in the main bodyare arranged overlapping one another. If electrodes of the differentfirst and second electrode stacks overlap one another, a capacitoreffect may be achieved especially simply in the overlap region of theelectrodes of different electrode stacks if they have differentpotentials applied to them.

Furthermore, it is possible to position additional (floating) electrodesin the main body which do not contact any of the bumps or the electrodestacks. In this way, two separate overlapping electrode structures maybe connected in series internally. The floating electrodes, above all ifthey overlap with electrodes of the first or second electrode stack,ensure greater uniformity of the electrical characteristics of amultilayer component according to the present invention. Therefore,multilayer components according to the present invention which displayan especially homogeneous electrical behavior may thus be manufacturedusing these electrodes.

Furthermore, a third electrode stack, which comprises at least oneadditionally provided electrode, may advantageously be provided in themain body and be connected in an electrically conductive way to a thirdbump on the surface of the main body via through contacts. Theelectrodes of the third electrode stack may then overlap with anelectrode of the first and the second electrode stacks. An embodiment ofthis type allows the internal interconnection of multiple passivecomponents. The interconnection and wiring outlay is thus reducedespecially advantageously if the multilayer component is mounted on acircuit board, space on the circuit board also being saved. The thirdelectrode stack may be used in this case as a shared ground contact, forexample.

In an embodiment of the present invention, the electrodes of the firstand second electrode stacks do not overlap, these electrodes thenadvantageously being used primarily for varying the resistance of themultilayer component. This embodiment may also be advantageous forconstructing components having very small capacitances.

In a further embodiment, the first, second, and third electrode stacksmay each comprise one electrode. In this case, only the electrode of thethird electrode stack overlaps with the electrodes of the first andsecond electrode stacks. The electrodes of the first and secondelectrode stacks do not overlap in this case. This embodiment allows theintegration of multilayer capacitors into the multilayer componentaccording to the present invention especially simply, the electrode ofthe third electrode stack having the same potential in each case and theelectrodes of the second and third electrode stacks being able to havepotentials different therefrom in the case of interconnection. In thiscase, notwithstanding the second and third electrode stacks each havingone electrode, still further electrode stacks each having one electrodemay be provided, which overlap with the electrode of the third electrodestack (see, for example, FIG. 9).

In a further advantageous variation, the overlap areas between theelectrodes of the different electrode stacks have different sizes. Asalready noted above, because of the overlap of electrodes of differentelectrode stacks, which have different potentials in case ofinterconnection, a capacitor effect occurs. In this case, because of thedifferent sized overlap areas, different capacitances result (see, forexample, FIGS. 3A and 3B). A further variation of the electricalproperties of the individual passive components in the electricalmultilayer component according to the present invention may thusadvantageously be achieved. It is possible in this case that the overlapareas between the electrodes of the third electrode stack and theelectrodes of the second and first electrode stacks have different sizes(see, for example, FIGS. 3A and 3B).

Furthermore, a fourth and a fifth electrode stack made of electrodes,which are connected via through contacts to a fourth and fifth bump onthe surface of the main body, may be provided in the multilayercomponent according to the present invention. In this case, theelectrodes of the fourth electrode stack overlap with the electrodes ofthe second and the fifth electrode stacks (see, for example, FIGS. 4Aand 4B). Internal interconnections may again be implemented especiallysimply using this embodiment.

Furthermore, further electrode stacks which are connected to bumps viathrough contacts may be provided in the main body. In this way, furtherpassive components, such as the above-mentioned capacitors, varistors,or thermistors, may be comprised in the multilayer component accordingto the present invention, so that especially many components may beprovided at a high integration density in an especially small volume.

In the multilayer component according to the present invention, some ofthe electrodes which belong to different electrode stacks mayadvantageously be connected to one another in an electrically conductiveway (see, for example, FIG. 8). Using these electrical connections,further especially simple and advantageous internal interconnectionstailored to the particular intended use may be implemented in themultilayer component according to the present invention.

Furthermore, it is especially advantageous if all bumps are arranged onthe same main surface of the main body of a multilayer componentaccording to the present invention. It is then especially simplypossible to connect the component to a carrier substrate via the bumpsusing a flip chip arrangement, for example. The flip chip constructionallows especially space-saving and simple mounting of a multilayercomponent according to the present invention on a carrier substrate inthis case.

Furthermore, the dielectric layers may advantageously comprise a ceramicmaterial, since electroceramics are especially suitable. The ceramicmaterial may thus comprise a varistor ceramics based on one of ZnO—Biand ZnO—Pr. Furthermore, the ceramic material may comprise a capacitorceramics which is selected from the NPO ceramics, e.g., (Sm, Pa) NiCdO₃.These ceramics have temperature-dependent ∈_(r) values and are notferroelectric ceramics. Furthermore, ferroelectric ceramics having highdielectric constants, as well as doped BaTiO₃ and barrier layerceramics, may be used. These dielectric ceramics are described in thebook “Keramik [Ceramics]” by H. Schaumburg (Ed.), B. G. Teubner-VerlagStuttgart 1994 on pages 351 through 352 and 363, reference being made tothe entirety of these pages here. In addition, the ceramic material maybe selected from thermistor ceramics, NTC ceramics, comprising at leastone of nickel, manganese, spinel, and perowskite, for example. However,dielectric non-ceramic materials such as glass may also be used.

In an embodiment of a component according to the present invention, atleast five electrode stacks are provided in the main body, the main bodyhaving an area which is smaller than 2.5 mm². The five bumps forcontacting the electrode stacks are arranged on the same main surface inthis case. In multilayer components according to the present inventionhaving more passive integrated components, at least nine electrodestacks may be provided in the main body, for example, the main bodyhaving an area which is smaller than 5 mm². Nine bumps are provided onthe same main surface of the main body for the electrical contact of thenine electrode stacks for especially simple flip chip contacting. Ifeleven electrode stacks are provided in the main body, the main bodytypically has an area which is smaller than 8 mm², the eleven bumps forcontacting the electrode stacks also being arranged on the same mainsurface for flip-chip contacting.

Furthermore, in the component according to the present invention, alldielectric layers comprise advantageously at least one of a varistor,thermistor, or capacitor ceramics, so that preferably there are nodielectric layers in the main body which do not have at least one ofthese electrical properties.

In the following, the multilayer component according to the presentinvention is to be explained in greater detail on the basis of schematicfigures and exemplary embodiments.

DESCRIPTION OF THE DRAWINGS

FIG. 1 shows a typical component in a cross-section view.

FIGS. 2A through 9 show different embodiments of multilayer componentsaccording to the present invention in a top view and in across-sectional view.

FIG. 10 shows a multilayer component according to the present inventionwhich is mounted on a carrier substrate.

DETAILED DESCRIPTION

FIG. 1 shows a typical ceramic multilayer component, such as a varistor4, in a cross-sectional view. Large-area terminal contacts 2A and 2B arearranged on opposite front faces of the component, wherein theseterminal contacts contact electrodes 3 located in the interior of themain body. Thus, two electrode stacks are produced, each of electrodestacks contacting only one terminal contact. Because of the especiallylarge contact areas of terminal contacts 2A and 2B, parasiticcapacitances and inductances are present to a significant extent in thistypical component. Furthermore, a relatively large amount of space isnecessary for mounting this component on a carrier because of the largecontact areas.

FIG. 2A shows a top view of two different embodiments of an electricalmultilayer component according to the present invention. In this case,the bumps 10, 15, and 20, as well as further bumps, may be seen in thetop view. Furthermore, the through contacts 6, which are located belowthe bumps 10, 15, and 20 in the ceramic main body, are indicated withdashed lines. Furthermore, each of the uppermost electrodes are shown,which may be seen in the top view. In this case, a first bump 10 isprovided which contacts a first electrode 10A. The first bump faces asecond bump 15 which contacts a second electrode 15A. Furthermore, athird bump 20 is provided which contacts a third electrode 20A in anelectrically conductive way. In addition, two further electrodes 12 and13 and two further bumps 12A and 13A may be recognized, which bumpsassume the same position in relation to the third electrode 20A as dothe first and second electrodes. The overlap areas between the electrodelayers which contact different bumps represent capacitors, so that thereare four capacitors in the component in the left top view, while thereare correspondingly eight capacitors in the component in the right topview.

FIG. 2B shows a cross-sectional view along the line referenced by Athrough the component shown in a top view in FIG. 2A. In this case, afirst electrode stack 10B made of first electrodes 10A may be seen,which is connected in an electrically conductive way to the first bump10 be means of through contacts called vias 6A, 6B. Under-bump metalplatings (UBM) 7 are arranged between the bumps and the throughcontacts. However, these under-bump metal platings do not necessarilyhave to be provided. For example, it is also possible for the bumps tobe arranged directly on the through contacts. Furthermore, a secondelectrode stack 15B made of the second electrodes 15A is provided, whichis connected in an electrically conductive way to the second bump 15.The first electrode stack 10B and the second electrode stack 15B eachoverlap with the electrodes 20A of the third electrode stack 20B, whichis contacted via a third bump 20. If different potentials are applied tothe different bumps, a capacitor effect occurs in the overlap areasbetween electrodes of different potentials. If, in addition, a varistorceramics based on zinc oxide, for example, is used as the material forthe main body 5, an internal arrangement of a varistor and a capacitormay be implemented in this component. The bumps 10, 15, 20 areadvantageously arranged on a main surface 300 of the main body; throughcontacts 6A arranged closer to the bumps 10, 15, 20 being further fromneighboring front faces 500, 600 than through contacts 6B arrangedfurther from the bumps 10, 15, 20. This may have the advantage, amongother things, that in this way the bumps 10, 15 neighboring the frontfaces are further from the front faces than they would be if all throughcontacts 6A, 6B were arranged one on top of another. In this way, amongother things, the production of the bumps and the stacking of thedielectric layers are simplified.

FIG. 2C shows a circuit diagram of the region of the component providedwith a circle in FIG. 2B. It may be seen that a parallel circuit isimplemented between a varistor 50 and a capacitor 40 in this area.

FIG. 3A shows a further advantageous embodiment of a component accordingto the present invention in a top view. In this case, analogously toFIG. 2A, an arrangement made of a first electrode 10A, a secondelectrode 15A, and a third electrode 20A may be seen, whereas each ofthese electrodes contacts and overlaps different bumps 10, 15, 20. Incontrast to FIG. 2A, however, different sized overlap areas between thefirst electrode 10A and the third electrode 20A and, in addition,between the second electrode 15A and the third electrode 20A areimplemented. These different sized overlap areas are referenced by 21and 22. Because of the different sized overlap areas, differentcapacitance values may thus be implemented especially simply. A total of12 multilayer capacitors are arranged in the component main body in thistop view, each 4 multilayer capacitors being interconnected internallyto one another via a shared third electrode.

FIG. 3B shows a cross-sectional view through the line referenced by B inFIG. 3A. In this case, the different sized overlap areas 21 and 22between the first electrode 10A and third electrode 20A and between thesecond electrode 15A and the third electrode 20A may be seen clearly.

FIG. 4A shows a top view of a further embodiment of a multilayercomponent according to the present invention. In contrast to theembodiments shown until now, the second electrode 15A contacts, apartfrom the third electrode 20A, the fourth electrode 25A being connectedto a fourth bump 25. Furthermore, a fifth bump 30 is provided, which isconnected in an electrically conductive way to a fifth electrode 30A andonly overlaps with the fourth electrode 25A. The fourth additionalelectrode thus overlaps both with the second electrode and also with thefifth electrode. Further internal interconnections may be implementedespecially simply in the multilayer component according to the presentinvention with the aid of this arrangement. In the top view of thiscomponent, a total of 16 multilayer capacitors may be recognized,wherein each of said multilayer capacitors is produced at the overlapareas between the electrodes of different electrode stacks, eightmultilayer capacitors each being interconnected internally to oneanother.

FIG. 4B shows a cross-sectional view along the line referenced with Cthrough the component shown in a top view in FIG. 4A. The thirdelectrodes 20A may be contacted with ground via the third bump 20, andthe fourth electrodes 25A may be contacted with ground via the fourthbump 25.

FIG. 5A shows a top view of an embodiment of a multilayer componentaccording to the present invention in which two multilayer capacitorsare implemented that are not internally interconnected to one another.

FIG. 5B shows a cross-sectional view through the line referenced with Din FIG. 5A. First electrodes 10A, which overlap with second electrode15A and are each connected in an electrically conductive way to bumps 10and 15, may be seen.

FIG. 6A shows a top view of an embodiment of the multilayer component,in which a total of eight electrodes face one another withoutoverlapping, so that a region 11 having no electrodes is provided in themain body between the electrodes. Arrangements of this type may be usedfor the purpose, for example, of altering the component resistance, thevaristor voltage, or the capacitance arbitrarily.

FIG. 6B shows a cross-sectional view through the line referenced with Ein FIG. 6A. The two electrode stacks 10B and 15B face one another in themain body 5, the region 11 without electrodes being provided between thetwo electrode stacks.

FIG. 7A shows a top view of an arrangement made of electrodes 10A and15A connected to bumps 10 and 15 and floating electrodes 60, which arenot contacted by a bump. These additional electrode layers mayespecially advantageously ensure greater uniformity of the electricalcharacteristics of the component.

FIG. 7B shows a cross-sectional view through the line referenced with Fin FIG. 7A. It may be seen in this case that the additional floatingelectrodes 60 overlap with the first electrodes 10A and the secondelectrodes 15A.

FIG. 8 shows a further favorable variation of a multilayer componentaccording to the present invention, in which the electrodes 20A and 80A,which are contacted by different bumps 20 and 80, are connected to oneanother in an electrically conductive way via a connection 70. Furtherinternal interconnections may thus be implemented especiallyadvantageously in components according to the present invention.

FIG. 9 shows a cross-sectional view of a further variation of amultilayer component according to the present invention, in whichelectrodes 10A and 15A, which do not overlap one another, overlap with asingle large electrode 20A, which is contacted by a bump 20 and may becontacted with ground, for example.

FIG. 10 shows a cross-sectional view of an arrangement of a component 1according to the present invention, which is mounted via the bumps 10,15, 20 via contact pads 90 on a carrier substrate 100 using flip chiparrangement with clearance. The flip chip arrangement allows especiallysimple, rapid, and cost-effective mounting of the components accordingto the present invention, these components being able to be mounteddirectly neighboring one another without larger intervals on thesubstrate 100.

The through contacts in all embodiments shown may be produced, forexample, by producing through holes, using a stamping tool in the mainbody, for example, an electrically conductive material comprising atleast one of Ag, AgPd, AgPdPt, AgPt, Pd, Pt, and Cu then being arrangedin the through holes. The through contacts in the form of through holesadvantageously have circular cross-sections in this case, as shown inFIG. 2A, for example, but may also have angled cross-sections. Thethrough holes may advantageously be produced in the dielectric materiallayers, the electrically conductive material then being filled into thethrough holes. The through contacts form channels in the main bodywhich, as shown in FIGS. 2A and 2B, for example, preferably runperpendicularly to the main surfaces of the ceramic main body. The bumpsare arranged on both main surfaces of the main body and/or only on onemain surface of said main body. Subsequently, the stacked dielectricmaterial layers, e.g., ceramic green films, may then be sinteredtogether with the electrically conductive material arranged in thethrough holes in one method step, the finished sintered main body havingthe through contacts being produced. The sintering temperature isselected in this case as a function of the composition of the dielectriclayers, e.g., 1000° C. to 1300° C. for varistor ceramics andtemperatures of approximately 850° C. to 1100° C. for other ceramics,e.g., for capacitor ceramics. Subsequently, the under-bump metalplatings and the bumps are then optionally produced. For example, solderpaste may be applied using printing methods, e.g., in the screenprinting method, and then melted. In other embodiments of the presentinvention, the bumps may also be placed and then melted or producedusing immersion wetting in hot solder (immersion solder bumping), forexample. Stud bumping is also possible, wherein bumps are produced,whereas a solder wire is first melted and then cut off.

The present invention is not restricted to the exemplary embodimentsdescribed here. Further variations are possible, above all in regard tothe number of the passive components arranged in the main body and theirinternal interconnections.

1. An electrical component having multiple layers, the electricalcomponent comprising: dielectric layers that are stacked to form a mainbody; electrodes positioned at intervals between at least some of thedielectric layers; at least two bumps configured to act as electricalcontacts for the electrical component, the bumps being on a surface ofthe main body; and contacts in the main body that electrically connectbumps and electrodes; wherein the electrodes comprise first and secondelectrode stacks, each of the first and second electrode stackscontacting one of the bumps; wherein the electrodes in at least thefirst electrode stack are electrically connected to first contacts andsecond contacts, the first contacts being offset from the secondcontacts; and wherein within the first electrode stack at least one ofthe bumps is connected to at least one of the electrodes by the firstcontacts, and at least a pair of two consecutive electrodes areconnected by the second contacts.
 2. The electrical component of claim1, wherein a first contact electrically connects electrodes in the firstelectrode stack to a bump, and a second contact electrically connectselectrodes in the second electrode stack to a bump.
 3. The electricalcomponent of claim 1, wherein the first and second electrode stacks faceeach other in the main body; and wherein the main body comprises aregion between the first and second electrode stacks that does notcontain an electrode.
 4. The electrical component of claim 1, whereinelectrodes from the first and second electrode stacks overlap.
 5. Theelectrical component of claim 1, further comprising: floating electrodesin the main body, wherein the floating electrodes do not contact thebumps.
 6. The electrical component of claim 5, wherein the floatingelectrodes overlap electrodes from at least one of the first and secondelectrode stacks.
 7. The electrical component of claim 1, furthercomprising: a third bump on a surface of the main body; and a thirdelectrode stack in the main body, the third electrode stack comprisingat least one electrode the third electrode stack being electricallyconnected to the third bump via a contact; wherein the at least oneelectrode in the third electrode stack overlaps an electrode in at leastone of the first and second electrode stacks.
 8. The electricalcomponent of claim 7, wherein electrodes in the first and secondelectrode stacks do not overlap.
 9. The electrical component of claim 7,wherein the first, second, and third electrode stacks each comprise oneelectrode.
 10. The electrical component of claim 7, wherein overlapareas between electrodes from different electrode stacks have differentsizes.
 11. The electrical component of claim 7, wherein electrodeoverlap areas between the third electrode stack and the first electrodestacks have different sizes than electrode overlap areas between thethird electrode stack and the second electrode stack.
 12. The electricalcomponent of claim 7, further comprising: a fourth bump on a surface ofthe main body; a fifth bump on a surface of the main body; a fourthelectrode stack comprising electrodes in the main body; a fifthelectrode stack comprising electrodes in the main body; and contactsthat contact the fourth electrode stack to the fourth bump and thatcontact the fifth electrode stack to the fifth bump; wherein electrodesin the fourth electrode stack overlap electrodes in the second electrodestack and electrodes in the fifth electrode stack.
 13. The electricalcomponent of claim 1, further comprising: additional bumps on thesurface of the main body; and additional electrode stacks in the mainbody, each of the additional electrode stacks being connected to acorresponding additional bump.
 14. The electrical component of claim 13,wherein at least some electrodes from different electrode stacks areelectrically connected to one another.
 15. The electrical component ofclaim 12, wherein all bumps are on a same main surface of the main body.16. The electrical component of claim 1, wherein the dielectric layerscomprise a ceramic material.
 17. The electrical component of claim 16,wherein the ceramic material comprises a varistor ceramic based on oneof ZnO—Bi and ZnO—Pr.
 18. The electrical component of claim 16, whereinthe ceramic material comprises a capacitor ceramic comprising one of NPOceramics and doped BaTiO₃.
 19. The electrical component of claim 16,wherein the ceramic material comprises at least one of nickel,manganese, spinel, and perowskite.
 20. The electrical component of claim1, wherein the dielectric layers comprise glass.
 21. The electricalcomponent of claim 1, further comprising: at least three additionalbumps on the surface of the main body; and at least three additionalelectrode stacks in the main body, each of the electrode stacks beingelectrically connected to a corresponding bump; wherein the main bodyhas an area of less than 2.5 mm².
 22. The electrical component of claim1, further comprising: at least seven additional bumps on the surface ofthe main body; and at least seven additional electrode stacks in themain body, each of the electrode stacks being electrically connected toa corresponding bump; wherein the main body has an area of less than5.12 mm².
 23. The electrical component of claim 1, further comprising:at least nine additional bumps on the surface of the main body; and atleast nine additional electrode stacks in the main body, each electrodestack being electrically connected to a corresponding bump; wherein themain body has an area of less than 8 mm².
 24. The electrical componentof claim 1, wherein the contacts comprise channels in the main body thatcontain an electrically conductive material.
 25. The electricalcomponent of claim 24, wherein the channels have one of a round and arectangular cross-section.
 26. The electrical component of claim 1,further comprising: additional contacts in the main body thatelectrically interconnect electrodes in a single electrode stack theadditional contacts being in different dielectric layers and beingoffset from one another, the electrical component comprising firstadditional contacts for the first electrode stack and second additionalcontacts for the second electrode stack.
 27. The electrical component ofclaim 26, wherein the main body has two opposite main surfaces and twofront faces, the bumps being on the main surfaces; and wherein contactscloser to the bumps are at a greater distance from neighboring frontfaces of the electrical component than contacts farther away from thebumps.
 28. The electrical component of claim 24, wherein theelectrically conductive material comprises at least one of Ag, AgPd,AgPt, AgPdPt, Pd, Pt, and Cu.
 29. An arrangement comprising: theelectrical component of claim 1; and a carrier substrate comprisingcontact pads for connecting to the electrical component, the contactpads being on a surface of the carrier substrate; wherein the electricalcomponent is mounted on the carrier substrate in a flip chip arrangementwith clearance relative to the carrier substrate; and wherein theelectrical component is electrically connected to the contact pads viathe bumps.